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This is a great site. I placed my order and by the next am it was available for download. Had some problems with some missing copy on some pages. Once I brought the error to the OMC's attention, the issue was resolved. I'll come back again.
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Mi spiace per non poter scrivere in inglese... ma sono veramente soddisfatto del servizio offerto. Grazie..!!
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The quality of this manual is good. It has all schematics and setup information for both the MDS-B3 and the MDS-B4. The scan quality is quite good, all pages are readable, This service manual also contains scans of the operating instructions from the User manual.
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Quick site processing. A complete and very useful manual with all details. Thank you!
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Das Service Manual war von der ersten bis zur letzten Seite sehr informativ und hilfreich. Die Darstellung aller Teile war klar und der Text gut lesbar.
Vielen Dank, das war nicht der letzte Download bei ownner-manuals.com.
With Soldering Iron: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)
Flat Pack-IC Desoldering Braid
(4) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.
Soldering Iron
Hot Air Blower
Fig. S-1-3 (2) Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)
or
Iron Wire
Soldering Iron To Solid Mounting Point
Fig. S-1-5
Sharp Pin Fine Tip Soldering Iron
Fig. S-1-4 (3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) With Iron Wire: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2) Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. (3) While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5
Flat Pack-IC Tweezers
CBA
Fine Tip Soldering Iron
Fig. S-1-6
1-4-2
DVD_NOTE
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