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There are currently no product reviews.
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This is a good quality scan of the Operation & Maintenance (Service) Manual for the PAL version of this high-band broadcast umatic, BVU-800P
All schematics and lineup procedures appear to be included in this one manual AFAICT.
The file size is just over 113 MB which gives an idea of the quality and number of pages.
All of the schematics, which contain some fairly small print, are easily readable when you zoom into the page.
John Thompson, Newcastle Upon Tyne, England.
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Good quality, all schematics of few of models. There is also short form of user manual and regulation manual.
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Perfect copy of the service manual. you can enlarge every page, and it comes up
with all details.
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It´s very very nice manual with all, what i need. Original in good quality. Very fast business. Very much thanks...
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Purchased the manual that I was looking for at a great price and could download it easily.. Great service experience and for future purchases I plan to use the site.
Thank you very much
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine: (1) Prepare the hot-air flat pack-IC desoldering machine, then apply hot air to the Flat Pack-IC (about 5 to 6 seconds). (Fig. S-1-1)
With Soldering Iron:
(1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)
Flat Pack-IC Desoldering Braid
Soldering Iron Fig. S-1-3
Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while applying the hot air. (3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Caution: 1. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) 2. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.
(2) Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)
Sharp Pin Fine Tip Soldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)
Hot-air Flat Pack-IC Desoldering Machine CBA
With Iron Wire:
(1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)
Masking Tape Tweezers
Flat Pack-IC
(2) Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. (3) While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5.
Fig. S-1-2
1-4-2
DVD_NOTE2
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