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Great scanned service manual
Usefull informations.
I will buy again!
Best Regards
;
The manual describes this product very good. It has the basic things to know and also a more detailed look. Very well made!
;
An excellent document to assist in the repair of my old personal tape player. It includes full circuit diagrams and physical layout drawings and full instructions on disassembly and fault finding.
Well worth the meagre price.
;
Very good conversation, Pretty fast Service, wood do it again,
Have paid by Paypal, so i got the Service Manual online after 15 Min.
Very helpfully.
Greeting from Germany,
Hans
;
Good-quality scans. Detailed description. I hope I can repair the machine.
ICD-P110VTP
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) Common Note on Schematic Diagrams: � All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums. � All resistors are in � and 1/4 W or less unless otherwise specified. � % : indicates tolerance. � f : internal component. � C : panel designation. � A : B+ Line. � Power voltage is dc 3V and fed with regulated dc power supply from external power voltage jack. � Voltage and waveforms are dc with respect to ground under no-signal (detuned) conditions. no mark : REC ( ) : PB � Voltages are taken with a VOM (Input impedance 10 M�). Voltage variations may be noted due to normal production tolerances. � Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. � Circled numbers refer to waveforms. � Signal path. E : PB a : REC � For CSP (chip size package), it is impossible to measure the voltage and waveforms since the package has a different outline from conventional IC�s.
� Waverforms � AUDIO board �
1
IC102 ta 4.096MHz OUT
1 Vp-p 0.5 V/DIV, 0.1 µs/DIV
� MAIN board �
1
IC702 <z/, 4.096MHz OUT
1.2 Vp-p 0.5 V/DIV, 0.1 µs/DIV
2
IC704 qd 12MHz OUT
Common Note on Printed Wiring Boards: � X : parts extracted from the component side. � Y : parts extracted from the conductor side. � f : internal component. � : Pattern from the side which enables seeing. (The other layer�s patterns are not indicated.) Caution: Pattern face side: (SIDE B) Parts face side: (SIDE A)
1.2 Vp-p 0.5 V/DIV, 0.1 µs/DIV
Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.
* A special tool is necessary to serve to IC702 used in this.
� Lead Layouts
front view
Lead layout of conventional IC
CSP (chip size package)
ICD-P110VTP
16
16
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