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1. Temporary fix FLAT PACKAGE IC by soldering on two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder using the specified solder, in the direction of the arrow, by sliding the soldering iron.
11.4. BRIDGE MODIFICATION PROCEDURE 1. Lightly re-solder the bridged portion. 2. Remove the remaining solder along pins using a soldering iron as shown in the figure below.
12. EXPLANATION OF CONNECTORS
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