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Good manual contains all it takes to update, repair,these types of mixers.Thanks.
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Great service. Fast response. High quality scan. Good price.
Thank you very much!!!
Oleg S.
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Well-scanned, complete manual. Contains the information needed for repair and maintenance.
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It's great to be able to obtain a precious technical information for a real old equipment. The one I got helps me a lot in the area of wiring diagram to repair my antique. PDF gave me clear enough information to find out thr details. Thanks for giving me the oppotunity to be able to access to almost vanished informations.
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Another excellent aquisition. Fine detailed manual. Thanks
KX-TG1032B/KX-TGA101B
9.5.
9.5.1.
How to Replace the LLP (Leadless Leadframe Package) IC
Preparation
� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608°F ± 68°F (320°C ± 20°C)
9.5.2.
Caution
� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
9.5.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P. C. board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely. Note: � Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P. C. board.
3. After removing the IC, clean the P. C. board of residual solder.
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