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I'm quite impressed. I had to wait 24 hours for my manual (quite a rare one) but I got it and the quality was good. Also, from trawling the web, these prices are by far the best.
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Manuale perfetto. Ottimo e utilissimo. Grazie a questo manuale ho potuto realmente risolvere il complesso problema della stampante.
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Manuale perfetto. Ottimo e utilissimo. Grazie a questo manuale ho potuto realmente risolvere il complesso problema della stampante.
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Was very fast and accurate service. Just what I needed. I recommend to everyone.
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Very good scan quality, only PC Board scan not enough contrast.
KX-TG8231B/KX-TG8232B/KX-TGA820B
9.5.
9.5.1.
How to Replace the LLP (Leadless Leadframe Package) IC
Preparation
� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608°F ± 68°F (320°C ± 20°C)
9.5.2.
Caution
� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
9.5.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P. C. board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely. Note: � Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P. C. board.
3. After removing the IC, clean the P. C. board of residual solder.
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