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Fully functional usable service manual. Considering the age of the manual and device quality was better than expected
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Thank you very much, I've been very happy to find this manual on "Owner Manual". It's a perfect copy and it has been really useful for my work!
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It took about 24-hours after my payment before I was able to get to the download. Apparently, payment processing is not 100% automated. That is no big deal, just be aware of that going in.
After I got to it, it was in good shape, easy to read, etc. Not some cheap FAX copy looking thing.
Also, this site was the cheapest I found. Another Plus!
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Good price, very legible manual, exactly what I needed -- but had to wait a day to actually get the download of the manual. Would have preferred to download it immediately after payment rather than waiting for someone to "process" my order. I was surprised that I had to wait that long.
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As the only source for this manual it rather rank quite high since it is well scanned and perfectly readable.
KX-TG8231B/KX-TG8232B/KX-TGA820B
9.5.
9.5.1.
How to Replace the LLP (Leadless Leadframe Package) IC
Preparation
� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608°F ± 68°F (320°C ± 20°C)
9.5.2.
Caution
� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
9.5.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P. C. board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely. Note: � Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P. C. board.
3. After removing the IC, clean the P. C. board of residual solder.
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