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Dear Sirs,
Thank you for the fast support, the manual does provide all necessary information to repair the radio. All schematics are in a good quality for reading.
The manual fits 100% to my requirements as a technican.
Kind regards Thomas
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the big video recorder format s-vhs many features delicate in loading system of the cassette. Such machines are no longer manufactured, it would be too expensive.
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THIS MANUAL IS VERY GOOD AND VERY CLEAR
PLEASE NOTE IT DOES NOT CONTAIN THE SETUP INFORMATION TO ALIGHN THE GEARS IN THE CD MECH IT DOES SHOW ALL THE PARTS AND THEIR LOCATIONS .
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Complete service and operation manual. All schematics are there, all circuit boards AND add-on boards. Including exploded views ,component names and specifications. Also electrical and mechanical adjustment procedures are in this manual. This manual also covers the more advanced BR-S811E unit. Scan quality is fair and usable.
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High quality scan of original Service Manual. Everything´s fine!
KX-TG8231B/KX-TG8232B/KX-TGA820B
9.5.
9.5.1.
How to Replace the LLP (Leadless Leadframe Package) IC
Preparation
� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608°F ± 68°F (320°C ± 20°C)
9.5.2.
Caution
� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
9.5.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P. C. board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely. Note: � Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P. C. board.
3. After removing the IC, clean the P. C. board of residual solder.
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