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It's a good manual, this one it's a scan from the original factory service manual, great quality 100% readeable. definetely it worths what I paid for.
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A good manual! fast service and good qualityi for pdf document.
thanks!
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Very helpful and complete manual. Maybe only one negative is schematics have sometimes unreadable name of the parts. But it's not a big problem.
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Excellent high quality schematics brought my old Heidelberg back to life. Fast download at a reasonable price. Thanks.
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This document is just what I was looking for, it´s very useful, it contains adjustment procedures for the final stage of the power amp and also
has a complete wiring diagram and description of the main semiconductors used in the design.
KX-TG9348T/KX-TGA931T/KX-TGA936B
10.3. How to Replace the LLP (Leadless Leadframe Package) IC
10.3.1. Preparation
� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608 °F ± 68 °F (320 °C ± 20 °C)
10.3.2. Caution
� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
10.3.3. How to Remove the Shield Case
Note: If you don�t have special tools (ex. Hot air disordering tool), conduct the following operations. 1. Cut the case along perforation.
2. Remove the cut part.
3. Cut the four corners along perforation.
4. Remove the reminds by melting solder.
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