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I PURHASED THIS PRODUCT BECAUSE I WAS HAVING PROBLEMS WITH MY CDR20 HARMAN KARDON RECORDER. WHICH I PURCHASED NEW 12 YEARS AGO. AFTER REVIEWING THE MANUAL, I WAS ABLE TO ADJUST THE TENSIONER IN THE SYSTEM. WORKS LIKE A CHAMP!.
SAVED ME AT LEAST 100.00 WHICH WAS WHAT A SERVICE REPAIR STATION WANTED. GREAT MANUAL EASY TO READ. SPECIALLY AFTER I PRINTED THE PAGES WHICH DEALT WITH MY RECORDER. THANKS A LOT!!!!!!!!
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You can fully trust on this one!
All the schematics are very crear an in one piece per page
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I have never bought a service manual which is as competely readable as this althogh it was a scanned pdf. Thank you for this succesful manual also cheaper than other sites.
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Thanks for a very good and readable servicemanual. Just what I needed as a "dinosaur technician". I really recommmend this site and will come back.
Åsbjörn
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The manual I purchased was just what I needed. I was glad to find a site where I can find so many manuals on a wide variety of products.
KX-TG1032B/KX-TGA101B
9.5.
9.5.1.
How to Replace the LLP (Leadless Leadframe Package) IC
Preparation
� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608°F ± 68°F (320°C ± 20°C)
9.5.2.
Caution
� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
9.5.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P. C. board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely. Note: � Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P. C. board.
3. After removing the IC, clean the P. C. board of residual solder.
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