|
|
|
Categories
|
|
Information
|
|
Featured Product
|
|
|
 |
|
|
There are currently no product reviews.
 ;
El producto satisface las necesidades del servicio t
;
This is a good quality scan of the Operation & Maintenance (Service) Manual for the PAL version of this high-band broadcast umatic, BVU-800P
All schematics and lineup procedures appear to be included in this one manual AFAICT.
The file size is just over 113 MB which gives an idea of the quality and number of pages.
All of the schematics, which contain some fairly small print, are easily readable when you zoom into the page.
John Thompson, Newcastle Upon Tyne, England.
;
Good quality, all schematics of few of models. There is also short form of user manual and regulation manual.
;
Perfect copy of the service manual. you can enlarge every page, and it comes up
with all details.
;
It´s very very nice manual with all, what i need. Original in good quality. Very fast business. Very much thanks...
KX-TG8231B/KX-TG8232B/KX-TGA820B
9.5.
9.5.1.
How to Replace the LLP (Leadless Leadframe Package) IC
Preparation
� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608°F ± 68°F (320°C ± 20°C)
9.5.2.
Caution
� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
9.5.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P. C. board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely. Note: � Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P. C. board.
3. After removing the IC, clean the P. C. board of residual solder.
51
|
|
|
> |
|
