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Service Notes
Note: Some components may be affixed with glue. Be careful not to break or damage foil under the component or at the pins of the ICs when removing. Usually applying heat to the component for a short time while twisting with tweezers will break the component loose.
Leadless Chip Component (surface mount)
Chip components must be replaced with identical chips due to critical foil track spacing. There are no holes in the board to mount standard transistors or diodes. Some chips, capacitor or resistor board solder pads may have holes through the board, however the hole diameter limits standard resistor replacement to 1/8 watt. Standard capacitor may also be limited for the same reason. It is recommended that identical components be used. Chip resistors have a three-digit numerical resistance code - 1st and 2nd significant digits and a multiplier. Example: 162 = 1600 or 1.6kW resistor, 0 = 0W (jumper). Chip capacitors generally do not have the value indicated on the capacitor. The color of the component indicates the general range of the capacitance. Chip transistors are identified by a two-letter code. The first letter indicates the type and the second letter, the grade of transistor. Chip diodes have a two-letter identification code as per the code chart and are a dual diode pack with either common anode or common cathode. Check the parts list for correct diode number.
How to Replace Flat-IC - Required Tools � Soldering iron � De-solder braids � Needle nose pliers � Magnifier � Wire cutters (sharp & small) 1. Cut the pins of a defective IC with wire cutters. Remove IC from board. If IC is glued to the board, heat the IC and release the IC. See Note above.
Flat IC
2. Using soldering iron and needle nose pliers remove the IC pins from the board.
Soldering Iron 3. Using de-soldering braid and soldering iron remove solder from affected are on board (pads). De-soldering Braid Soldering Iron 4. Position the new Flat-IC in place (apply the pins of the Flat-IC to the soldering pads where the pins need to be soldered). Determine the positions of the soldering pads and pins by correctly aligning the polarity symbol. Solder pin #1 first, align the IC. Polarity symbol
2nd solder 1st solder
Component Removal
7. Use solder wick to remove solder from component end caps or terminal. 8. Without pulling up, carefully twist the component with tweezers to break the adhesive. 9. Do not reuse removed leadless or chip components since they are subject to stress fracture during removal.
Chip Component Installation
1. Put a small amount of solder on the board soldering pads. 2. Hold the chip component against the soldering pads with tweezers or with a miniature alligator clip and apply heat to the pad area with a 30 watt iron until solder flows. Do not apply heat for more than 3 seconds. Chip Components
Solder the pin opposite to pin #1. This will assist positioning the IC. 5. Solder all pins to the soldering pads using a fine tipped soldering iron.
Soldering Iron 6. Check with a magnifier for solder bridge between the pins or for dry joint between pins and soldering pads. To remove a solder bridge, use a de-solder braid as shown in the figure below. Solder
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